Structure: (PI / Silicone / Epoxy Substrate) + PTC Heating Element Key Advantage: The world's only flexible, printable self-regulating PTC material. Offers precise temperature control, inherent safety, and rapid heating. Key Specifications: Rated Voltage: 3.7V – 1000V (Customizable) Power Density: 0.01 – 2.0 W/cm² Self-Regulating Temperature: 65°C, 75°C, 85°C, 100°C available Applications: New Energy Vehicles Energy Storage Systems Consumer Electronics Medical Devices Industrial Equipment Underfloor Heating & Building Comfort
Core Structure & Technology: Three patented technologies enable high-performance thermal management solutions. Offers two product lines: HGP-1, HGP-S Key Specifications: Thermal Conductivity: >30 W/m·K (Pad), >1700 W/m·K (Film) Thermal Impedance: <0.3 K·cm²/W (20% compression) Long-Term Stability: <3% Oil Bleed (125°C, 48h) Applications: 5G/6G Communication Equipment High-Power Chip Cooling New Energy Vehicles Consumer Electronics Data Centers Energy Storage Systems Industrial Electronics
We provide superior thermal interface materials designed to enhance device efficiency and longevity.